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The microDAC method. A powerful means for microdeformation analysis in electronic packaging

 

Suhling, J.C. ; American Society of Mechanical Engineers -ASME-, Electrical and Electronic Packaging Division:
Applications of Experimental Mechanics to Electronic Packaging 1997
New York, NY: ASME, 1997 (AMD 226)
ISBN: 0-7918-1850-0
International Mechanical Engineering Congress and Exposition <1997, Dallas/Tex.>
Englisch
Konferenzbeitrag
Fraunhofer IZM ()

: http://publica.fraunhofer.de/dokumente/PX-23913.html