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Mechanical reliability of silicon wafer-bonded components

: Bagdahn, J.; Katzer, D.; Petzold, M.

Reichl, H.; Obermeier, E. ; MESAGO Messe Frankfurt GmbH, Stuttgart; Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin:
Micro System Technologies '98
Berlin: VDE-Verlag, 1998
ISBN: 3-8007-2421-9
S.379-384 : Ill., Lit.
International Conference on Micro-, Electro-, Opto-, Mechanical Systems and Components <6, 1998, Potsdam>
Fraunhofer IWM ()

Sufficient mechanical strength and reliability are important prerequisites for the industrial application to technical components. Frequently, wafer bonding technologies are involved to fabricate micromechanical components, such as acceleration sensors, micropumps, or microvalves. In these cases, the mechanical reliability of the whole component is strongly affected by the reliability properties of the bonded interface. A further important point to keep in mind is that fatigue and corrosion processes can lower the bond strength with raising time of application or increasing number of loading cycles. To study the strength related properties, different tests were developed and adapted to the special conditions of wafer-bonded components. These tests can be applied to derive the technical fracture limit of a micromechanical component, to measure the atomic bond strength in the interface as a function of the bonding technology or to characterise the life time under mechanical loading. It w as shown that mechanically stressed wafer-bonded samples can fracture after having reached a limited life time. As a consequence, also components which have passed a fast-loading strength test after fabrication bear the risk to fall after a certain time of use. This behaviour is due to the mechanism of stress corrosion cracking in the bonded interface. To ensure a high reliability during application, this effect must be carefully considered during the fabrication and layout of wafer-bonded micromechanical devices.