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Measurement of thermal microdeformations in bumps
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1995
Conference Paper
Titel
Measurement of thermal microdeformations in bumps
Author(s)
Kühnert, R.
Michel, B.
Hauptwerk
IEEE Workshop on Area Packaging Technologies '95. Proceedings
Konferenz
Workshop on Area Packaging Technologies 1995
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM