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Mask aligners in advanced packaging


Solid state technology 41 (1998), Nr.3, S.S13-S14
ISSN: 0038-111X
Fraunhofer IZM ()
integrated circuit interconnections; integrated circuit packaging; masks; multichip module; photolithography; tape automated bonding

New packaging technologies, developed to support the increasing functionality and performance of today's and future IC generations, increasingly use photolithography for the fabrication of high-density interconnect layers and tape automated bonding (TAB) or solder bumps. Screen printing and physical vapor deposition into a metal mask are running into resolution and reliability limits where the highest performance is needed. We have found that photolithography by proximity printing with a mask aligner meets the technological and economic demands of the industry.