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Low cost flip chip technologies on chemical nickel bumping and solder printing
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1997
Journal Article
Titel
Low cost flip chip technologies on chemical nickel bumping and solder printing
Author(s)
Kloeser, J.
Gwiasda, J.
Ostmann, A.
Aschenbrenner, R.
Reichl, H.
Bechtold, F.
Zeitschrift
International Journal of Microcircuits and Electronic Packaging
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM