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1990
Conference Paper
Titel
Isolationsschichten auf der Grundlage organisch modifizierter Keramiken und deren Applikationen
Alternative
Insulation layers on base of organic modified ceramics and their application
Abstract
The need for efficiency of electronic products requires an increasing integration density in the field of the PCB-production. For this application materials with a high level of thermal, chemical, and electrical properties are required. A suitable polymer system has been developed which can be applied e.g. by an electrophoretic deposition or dip coating procedure on metallic materials (metal core base materials). This thermal and photocurable new inorganic-organic hybrid polymer (ORMOCER = ORganically MOdified CERamics) shows excellent electrical, thermal, and chemical properties compared to those required for FR-4 materials.
Language
German