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Investigations of flip chip interconnections on green tape ceramic substrates
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1993
Conference Paper
Titel
Investigations of flip chip interconnections on green tape ceramic substrates
Author(s)
Klöser, J.
Zakel, E.
Engelmann, G.
Distler, H.
Hauptwerk
5th International TAB/Advanced Packaging Symposium 1993. Proceedings
Konferenz
International TAB/Advanced Packaging Symposium (ITAP) 1993
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM