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Interaction between electronic pastes and AlN-substrate.

Wechselwirkungen zwischen Elektronikpasten und AlN-Substrat
 

Duran, P.; Fernandez, J.F. ; European Ceramic Society:
Third Euro-Ceramics 1993. Proceedings of the Third European Ceramic Society Conference. Vol.1: Processing of ceramics
Castellon de la Plana: Faenza Editrice Iberica, 1993
ISBN: 84-87683-05-3
S.1127-1131
Euro-Ceramics (ECerS) <3, 1993, Madrid>
Englisch
Konferenzbeitrag
Fraunhofer IKTS ()
aluminium nitride; Aluminiumnitrid; Dickschichttechnik; Glas; Glass; paste; resistor; ruthenium dioxide; Rutheniumdioxid; Thermoanalyse; thermoanalysis; thick films; Widerstand

Abstract
Electronic pastes (resistors, conductors, dielectrics) on AlN-ceramics are far reactive systems than on Al2O3-ceramics; frequently it is observed, that pastes bubble during firing, because gaseous products cannot escape the layer. Therefore an important task of the paste development is to find bubble-free range by appropriate variation of the powder properties to get a tool for production-technological controlling. Using non-reducible glasses we get the best results. But chemical reactions can be desirable between the glass of the conductor paste and AlN to increase the adhesion of the layer in the aged state.

: http://publica.fraunhofer.de/dokumente/PX-19568.html