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Influences of flip chip layout on the underfilling process
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1998
Conference Paper
Titel
Influences of flip chip layout on the underfilling process
Author(s)
Becker, K.-F.
Schaub, M.
Mießner, R.
Ansorge, F.
Aschenbrenner, R.
Reichl, H.
Hauptwerk
EuPac '98. 3rd European Conference on Electronic Packaging Technology & 9th International Conference on Interconnection Technology in Electronics. Lectures and poster
Konferenz
European Conference on Electronic Packaging Technology (EuPac) 1998
International Conference on Interconnection Technology in Electronics 1998
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM