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1996
Conference Paper
Titel
The influence of NiSn intermetallics on the performance of flip chip contacts using a low cost electroless nickel bumping approach
Language
English
Tags
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ageing
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automotive electronics
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electroless deposition
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environmental degradation
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flip-chip devices
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gold
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integrated circuit interconnections
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integrated circuit packaging
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integrated circuit reliability
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laminate
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mechanical testing
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microassembling
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multichip module
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nickel
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nickel alloys
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Soldering
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tin alloys