Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
The influence of NiSn intermetallics on the performance of flip chip contacts using a low cost electroless nickel bumping approach
:
Jung, E.
;
Giebler, R.
;
Klöser, J.
;
Dietrich, L.
;
Zakel, E.
;
Reichl, H.
;
Kasulke, P.
;
Ostmann, A.
International Electronics Packaging Society -IEPS-:
International Electronics Packaging Conference 1996. Proceedings
Edina, Minn.: International Electronics Packaging Society, 1996
S.14-25
International Electronics Packaging Conference <1996, Austin/Tex.>
Englisch
Konferenzbeitrag
Fraunhofer IZM
(
)
ageing
;
automotive electronics
;
electroless deposition
;
environmental degradation
;
flip-chip devices
;
gold
;
integrated circuit interconnections
;
integrated circuit packaging
;
integrated circuit reliability
;
laminate
;
mechanical testing
;
microassembling
;
multichip module
;
nickel
;
nickel alloys
;
Soldering
;
tin alloys
