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1992
Conference Paper
Titel
High performance gold plating for microdevices
Abstract
Tremendous improvements in the performance of microelectronic devices have been creating increased demands on fabrication control and consequent application of a synergistic operational model, high quality gold layers have been deposited from a sulfitic gold electrolyte. Periodic recording both of existing process data and resulting layer properties yielded a synergistic model to control the plating using SEM and acoustomicroscopy. Futher factors that influence quality of gold deposits (hardness, roughness, uniformity) could be optimized by flexible process control.