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Title
Herstellung galvanisch abgeformter Kontakthoecker
Date Issued
1997
Author(s)
Aschenbrenner, R.
Ostmann, A.
Zakel, E.
Kasulke, P.
Patent No
1996-DE206
Abstract
The contact bumps are intended for the bottom of integrated circuits, the metal deposition is formed on a metallising subsequently located under the contact bump, using external current-free process. Preferably an Ni or Au deposition is carried out on the metal bond pad, typically of Al, as an under-bump metallising, prior to depositing a thin plating base (5) in an external current-free process, the metal of the plating base is to be so selected that there is no permanent diffusion between under-metallising and metal contact bumps. USE/ADVANTAGE - For flip-chip or TAB technique, without need for high cost sputtering.
Language
de
Patenprio
WO 1996-DE206 A: 19960209