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Grenzschichten in Klebverbindungen

 
: Hennemann, O.-D.

Deutscher Verband für Schweißtechnik e.V. -DVS-, Düsseldorf:
Verbindungstechnik in der Elektronik. Löten - Schweißen - Kleben. Vorträge des 3. Internationalen Kolloquiums
Düsseldorf: Dt. Verl. für Schweißtechnik, 1986 (DVS-Berichte 102)
ISBN: 3-87155-407-3
Internationales Kolloquium "Verbindungstechnik in der Elektronik" <3, 1986, Fellbach>
Deutsch
Konferenzbeitrag
Fraunhofer IFAM ()
Adhäsion; Adhäsionsoptimierung; Reinigung

Abstract
In adhesives technology, the main aim must be to optimize adhesion. This applies both to the strength and, in particular, to the ageing stability of the joint. The range of adhesive bonding forces is no more than a few Angström, thus resulting in both parts of the joint, the joint surfaces and the adhesive, having to be brought as close together as possible. The result of these secondary conditions is that cleaning of the joint surfaces is essential in the majority of cases. Since the adhesion is a surfacerelated factor, it is important not only to clean but also to maximize the joint area.

: http://publica.fraunhofer.de/dokumente/PX-16388.html