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Fracture and damage evaluation in chip scale packages and flip chip assemblies by FEA and MicroDAC

 

Chen, W.T. ; American Society of Mechanical Engineers -ASME-, Applied Mechanics Division:
Application of fracture mechanics in electronic packaging
New York, NY: ASME, 1997 (AMD 222)
ISBN: 0-7918-1827-6
S.133-138
International Mechanical Engineering Congress and Exposition <1997, Dallas/Tex.>
Symposium on Application of Fracture Mechanics in Electronic Packaging <1997, Dallas/Tex.>
Englisch
Konferenzbeitrag
Fraunhofer IZM ()

: http://publica.fraunhofer.de/dokumente/PX-15179.html