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Flip chip attachment of silicon devices using substrate ball bumping and the technology evaluation on test assemblies for 20 Gbit/s transmission

 
: Eldring, J.; Koeffers, K.; Richter, H.; Baumgärtner, A.; Reichl, H.

Institute of Electrical and Electronics Engineers -IEEE-:
ECTC '95. 45th IEEE electronic components and technology conference. Proceedings
1995
IEEE Electronic Components and Technology Conference <45, 1995, Las Vegas>
Englisch
Konferenzbeitrag
Fraunhofer IZM ()

: http://publica.fraunhofer.de/dokumente/PX-14785.html