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Flip chip attach of silicon and GaAs-fine pitch devices/Inner lead TAB using ball bump technology
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1994
Journal Article
Titel
Flip chip attach of silicon and GaAs-fine pitch devices/Inner lead TAB using ball bump technology
Author(s)
Eldring, J.
Zakel, E.
Reichl, H.
Zeitschrift
Hybrid Circuits
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM