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Fine pitch stencil printing of Sn/Pb and lead free solders for flip chip technology
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1997
Conference Paper
Titel
Fine pitch stencil printing of Sn/Pb and lead free solders for flip chip technology
Author(s)
Kloeser, J.
Heinricht, K.
Motulla, G.
Kutzner, K.
Jung, E.
Ostmann, A.
Zakel, E.
Reichl, H.
Hauptwerk
47th Electronic Components and Technology Conference 1997. Proceedings
Konferenz
Electronic Components and Technology Conference (ECTC) 1997
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM