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An environmental comparison of packaging and interconnection technologies

 

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Institute of Electrical and Electronics Engineers -IEEE-:
IEEE International Symposium on Electronics and the Environment 1998. Proceedings
Piscataway, NJ: IEEE, 1998
ISBN: 0-7803-4295-X
S.106-111
International Symposium on Electronics and the Environment (ISEE) <6, 1998, Oak Brook/Ill.>
Englisch
Konferenzbeitrag
Fraunhofer IZM ()
environmental factors; packaging; printed circuit manufacture

Abstract
Packaging and interconnection are driving forces behind the miniaturization of electronics. Since miniaturization means less use of resources this trend seems inherently environmentally benign. Adverse effects may overlay this simple truth. The investments for new production facilities rise, the complexity and closeness of non-separable compounds in electronic products increase and the amount and applications of electronic goods multiply. The goal must be to influence new technology developments as early as possible to ensure that the balance of the listed effects remains positive for the environment. As a first step in this direction a simple comparison of different interconnection options is made which is based on the material content of the different printed circuit board assemblies.

: http://publica.fraunhofer.de/dokumente/PX-12647.html