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Hybrid chip-scale integration of inertial MEMS by chip-to-wafer vacuum bonding
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2008
Conference Paper
Titel
Hybrid chip-scale integration of inertial MEMS by chip-to-wafer vacuum bonding
Author(s)
Marenco, N.
Reinert, W.
Kostner, H.
Hillmann, G.
Hauptwerk
Smart systems integration 2008
Konferenz
European Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICs and Electronic Components 2008
Language
English
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Fraunhofer-Institut für Siliziumtechnologie ISIT