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Thick film heater for aluminum nitride ceramics

 
: Hentsche, M.; Kretzschmar, C.; Grießmann, H.; Marcinkowski, P.; Rebenklau, L.

International Microelectronics and Packaging Society -IMAPS-:
41st International Symposium on Microelectronics 2008 : November 2-6, 2008, Rhode Island Convention Center, Providence, Rhode Island, USA
Reston, Va.: IMAPS, 2008
ISBN: 0-930815-86-6
S.1224-1228
International Symposium on Microelectronics <41, 2008, Providence/RI>
Englisch
Konferenzbeitrag
Fraunhofer IKTS ()
Aluminiumnitrid; Heizleiterlegierung; Heizelement; Silberlegierung; Palladium; Wärmeleitfähigkeit; Schichtwiderstand; Dickschichtpaste

Abstract
Heater pastes for aluminum nitride (AlN) are not in common use at present. Therefore, heater pastes with AgPd conductive components are under development This study shows the influence of the AgPd ratio in heater pastes on the film properties as well as on the heater characteristics. Therefore, three pastes with different AgPd ratios are prepared and tested. The formations of the heater materials are analyzed by insitu resistance measurements, X-ray studies and FESEM. The characterization of the heaters under electrical load and at different temperatures are investigated.

: http://publica.fraunhofer.de/dokumente/N-95593.html