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g-Pack - a generic testbed package for silicon photonics devices

: Zimmermann, L.; Schröder, H.; Tekin, T.; Bogaerts, W.; Dumon, P.

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Institute of Electrical and Electronics Engineers -IEEE-:
5th International Conference on Group IV Photonics 2008 : Sorrento, Italy, 17 - 19 September 2008
New York, NY: IEEE, 2008
ISBN: 978-1-4244-1769-8
International Conference on Group IV Photonics <5, 2008, Sorrento>
Konferenzbeitrag, Elektronische Publikation
Fraunhofer IZM ()

g-Pack is a low-frequency packaging approach to breadboarding of silicon photonics chips. It provides optical i/o through a fiber array coupled to gratings couplers, and multiple DC i/o through a pin grid array (PGA) carrier.