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Out-of-plane coupling using thin glass based arrayed waveguide components

: Schröder, H.; Arndt-Staufenbiel, N.; Brusberg, L.; Tekin, T.


Glebov, A.L. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
Photonics packaging, integration, and interconnects IX : 26 - 28 January 2009, San Jose, California, United States
Bellingham, WA: SPIE, 2009 (SPIE Proceedings Series 7221)
ISBN: 978-0-8194-7467-4
ISSN: 0277-786X
Paper 72210D
Conference "Photonics Packaging, Integration, and Interconnects" <9, 2009, San Jose/Calif.>
Fraunhofer IZM ()

Nano-photonics and electrical-optical integration are rapidly growing fields with a strong potential for applications in a wide spectrum covering optical sensing, data & telecommunication. Its merit of ultra compactness and planarity becoming a challenge since the periphery remained micro-level and out-of-plane coupling becomes necessary. We introduce new planar optical coupling elements for electrical-optical circuit boards, sensors and nano-devices. The novel photonic packaging technology using thin glass foils bridge the growing field of nano-photonics to the micro-photonic periphery. Innovative features are added to this technique to leverage its generic usage and first experimental results are presented.