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Plasma-printing and galvanic metallization hand in hand - A new technology for the cost-efficient manufacture of flexible printed circuits

: Möbius, A.; Elbick, D.; Weidlich, E.-R.; Feldmann, K.; Schüßler, F.; Borris, J.; Thomas, M.; Zänker, A.; Klages, C.-P.


Spyrellis, N.:
Nanotechnology and innovative coatings. Selection of Papers from the International Conference EURO-INTERFINISH 2007 : 18 - 19 October 2007, Athens, Greece
Amsterdam: Elsevier, 2009 (Electrochimica acta. Special issue 54.2009,Nr.9)
ISSN: 0013-4686
International Conference "Euro-Interfinish" <2007, Athens>
Konferenzbeitrag, Zeitschriftenaufsatz
Fraunhofer IST ()
Flexible Printed Circuit; plasma printing; dielectric barrier discharge; patterned metallization; plastic metallization

A new potentially cost-efficient technology combining patterned atmospheric pressure dielectric barrier discharge (DBD) treatment, here referred to as "plasnia-printing". and galvanic plating for the production of flexible printed circuits(FPC) is presented in this contribution. The technology is being jointly developed by partners from industry and academia, a major aim being the realization of the processes in a reel-to-reel production system. So far, plasma-printing experiments have been carried out using lab-scale batch plants. Using suitable plasma conditions and electroless plating baths. RFID-like tag and interdigital structures with line widths and spaces down to 100 mu m could already be produced. Adhesion of copper on DBD treated polyinticle foil reached up to about 1 N/mm, as was determined in a peel test similar to that described in the DIN 53494.