Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Microsystems technologies for use in structures and integrated systems

 
: Schönecker, A.; Gebhardt, S.

:

Vincenzini, P.:
Emboding Intelligence in Structures and Integrated Systems : Selected, peer reviewed papers from the Symposium C Emboding Intelligence in Structures and Integrated Systems of CIMTEC 2008 - 3rd International Conference Smart Materials, Structures and Systems, held in Acireale, Sicily, Italy, June 8-13, 2008
Dürnten: Trans Tech Publications, 2009 (Advances in science and technology 56)
ISBN: 3-908158-22-2
ISBN: 978-3-908158-22-6
S.76-83
Symposium C "Emboding Intelligence in Structures and Integrated Systems" <2008, Acireale, Sicily>
International Conference Smart Materials, Structures and Systems <3, 2008, Acireale, Sicily>
Englisch
Konferenzbeitrag
Fraunhofer IKTS ()

Abstract
Piezoceramics are considered as key functional material in micro systems and smart structure technology. Showing superior mechanical, dielectric, pyroelectric, ferroelectric and piezoelectric properties they introduce improved functionality, e.g. sensing, actuation, energy harvesting, health monitoring or shape control. Various applications such as micro integrated valves, drives, voltage converter, piezoelectric, pyroelectric and ultrasound sensors are expected. Another field of application concerns active structures in space, automotive or machine building industry. Progress was achieved by combining flexible board and piezo technology which opens up a new class of reliable ready to use actuator and sensor modules. Tailored design and packaging are seen as key factors for progress in custom applications. Load carrying structures with embedded actuators, sensors and electronics, which are usually pre-integrated in modules, offer the opportunity for noise reduction, vibration and shape control and health monitoring. The present paper summarizes the potential of advanced, microsystems compatible piezotechnology for active structures and systems. The focus will be given to PZT film and fibre processing and the integration in silicon wafer, ceramic multilayer and polymer matrix architectures. Finally, forward-looking applications are highlighted.

: http://publica.fraunhofer.de/dokumente/N-93841.html