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A uniform, reproducible and reliable GaN HEMT technology with breakdown voltages in excess of 160 V delivering more than 60% PAE at 80 V

 
: Waltereit, P.; Bronner, W.; Quay, R.; Dammann, M.; Müller, S.; Kiefer, R.; Walcher, H.; Raay, F. van; Kappeler, O.; Mikulla, M. et al.

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Volltext (PDF; )

International Conference on Compound Semiconductor Manufacturing Technology 2008. Digest of papers : April 14 - 17, 2008, Westin Chicago North Shore, Chicago, Illinois, U.S.A.
St. Louis: GaAS MANTECH, 2008
ISBN: 978-1-89358-011-4
S.83-86
International Conference on Compound Semiconductor Manufacturing Technology (CS MANTECH) <23, 2008, Chicago, Ill.>
Englisch
Konferenzbeitrag, Elektronische Publikation
Fraunhofer IAF ()
GaN; base station; Basisstation; reliability; Zuverlässigkeit; transistor; Transistor; HEMT

Abstract
We report on device performance and reliability of our 3" GaN HEMT technology. AlGaN/GaN HEMT structures are grown on semi-insulating SiC substrates by MOCVD with sheet resistance uniformities better than 3%. Device fabrication is performed using standard processing techniques involving both e-beam and stepper lithography. The process technology exhibits an excellent uniformity across a single wafer as well as high reproducibility between individual wafers of the same or a different batch. Loadpull mapping of 8x400 µm gate periphery devices with 0.5 µm gate length across all 21 cells on entire 3-inch wafers yields a PAE of (60±2)% with only 2% scatter of the mean PAE from wafer to wafer. AlGaN/GaN HEMT's demonstrate superior high-voltage stability and large efficiencies. Devices with 0.5 µm gate length exhibit two-terminal gate-drain breakdown voltages in excess of 160 V and drain currents well below 1 mA/mm when biased at 80 V drain bias under pinch-off conditions. Load-pull measurements at 2 GHz return both a linear relationship between drain bias voltage and output power as well as power added efficiencies beyond 60% up to 80 V drain bias. At 88 V an output power density of 15 W/mm with 24 dB linear gain is obtained. Reliability tests indicate a promising device stability under both radio frequency (RF) and direct current (DC) stress conditions.

: http://publica.fraunhofer.de/dokumente/N-87832.html