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Plasma-printing and galvanic metallization hand in hand - a new technology for the cost-efficient manufacture of flexible printed circuits

: Borris, J.; Thomas, M.; Zänker, A.; Klages, C.-P.; Möbius, A.; Elbick, D.; Weidlich, E.-R.; Feldmann, K.; Schüßler, F.

Dzur, B. ; TU Ilmenau:
XV. Workshop Plasma- und Oberflächentechnik 2008. Tagungsband : 26. und 27. Juni 2008, in Ilmenau
Ilmenau, 2008
ISBN: 978-3-00-024955-6
Workshop Plasma- und Oberflächentechnik <15, 2008, Ilmenau>
Fraunhofer IST ()

A new potentially cost-efficient technology combining patterned atmospheric pressure dielectric barrier discharge (DBD) treatment, here referred to as 'plasma-printing', and galvanic plating for the production of flexible printed circuits (FPC) is presented in this contribution. The technology is being jointly developed by partners from industry and academia, a major aim being the realization of the process in a reel-to-reel production system. So far, plasma-printing experiments have been carried out using lab-scale batch plants. Using suitable electroless plating baths, RFID-like tag and interdigital structures with line widths and spaces down to 200 micron could already be produced. Adhesion of copper on DBD treated polyimide foil reached up to about 1 N/mm, as was determined in a peel test similar to that described in the DIN 53494.