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2008
Conference Paper
Titel
Applications of laser transmission processes for the joining of plastics, silicon and glass micro parts
Abstract
Joining processes for microtechnology must fulfil special requirements concerning mechanical and thermal load of the components as well as their alignment accuracy. For these applications laser radiation as an energy source is ideally suited for joining with a minimum of energy load to the parts. In particular, laser transmission joining is used for joining plastics, silicon or glass using the total or partial transmission of the different materials and performing hidden joints inside a component. Since the optical properties of the materials play a decisive role for this joining technology, an optimization of absorbers and material conditions is of crucial importance for high quality joints. Investigations on different absorbent dyes for micro welding of plastics show their applicability, but also the limitations of these materials. For silicon and glass as well as silicon and silicon new fiber lasers with process-adapted wavelengths and strategies have been investigated and qualified as a versatile tool in micro assembly.
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