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Development of an M3-approach for optimal electromagnetic reliability in system packages

: Ndip, I.; Guttowski, S.; Reichl, H.

International Microelectronics and Packaging Society -IMAPS-:
International Symposium on Microelectronics 2007. Proceedings : November 11- 15, 2007, San Jose Convention Center, San Jose, California, USA
Washington, DC: IMAPS, 2007
ISBN: 0-930815-82-3
International Symposium on Microelectronics <40, 2007, San Jose/Calif.>
Fraunhofer IZM ()
M3-approach; electromagnetic reliability; system packages; electrical design and modeling

This contribution presents a novel and comprehensive design approach - the M3-approach (methodologies->models->measures) for reliable, cost-effective and optimal design of system packages such as System-in-Package (SiP) or System-on-Package (SoP). This design approach entails developing or applying a methodology for efficient and accurate electrical modeling of the package and its immediate surroundings. The extracted models are experimentally validated and used to study the impact of different packaging technologies and integration options, component placement and routing possibilities, immediate surroundings as well as process tolerances on system performance. Based on the results of these studies, design measures are extracted. Applying these measures at the pre-layout stage leads to the elimination of re-design efforts and place/route iterations. Consequently time-to-market as well as cost is considerably reduced, while performance is optimized.