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Nano-scaled functional layers for current and heat transport in electronics packaging

 
: Heimann, M.; Meißner, F.; Schönecker, A.; Endler, I.; Wolter, K.-J.

:
Volltext urn:nbn:de:0011-n-816191 (PDF)
MD5 Fingerprint: 61f223536eef03bae9f74b3efd29a767
© 2008 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.
Erstellt am: 11.9.2008


Institute of Electrical and Electronics Engineers -IEEE-:
2nd Electronics Systemintegration Technology Conference, ESTC 2008. Proceedings. Vol.1 : 1st - 4th September 2008, Greenwich, London, UK
Piscataway, NJ: IEEE, 2008
ISBN: 978-1-4244-2813-7
ISBN: 1-4244-2813-0
ISBN: 978-1-4244-2814-4
S.333-338
Electronics Systemintegration Technology Conference (ESTC) <2, 2008, London>
Englisch
Konferenzbeitrag, Elektronische Publikation
Fraunhofer IKTS ()

: http://publica.fraunhofer.de/dokumente/N-81619.html