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Micro- and nano-NDE for micro-electronics (back end)

 
: Wolter, K.-J.; Oppermann, M.; Heuer, H.; Köhler, B.; Schubert, F.; Netzelmann, U.; Krüger, P.; Zhan, Q.; Meyendorf, N.

Asociación Argentina de Ensayos No Destructivos y Estructurales -AAENDE-:
IV Pan-American Conference for Nondestructive Inspection 2007 : CORENDE 2007 Congreso Regional de Ensayos No Destructivos y Estructurales, 22.-26. October 2007, Buenos Aires
Buenoes Aires: AAENDE, 2007
S.p122
Pan-American Conference for Nondestructive Inspection <4, 2007, Buenos Aires>
Englisch
Konferenzbeitrag
Fraunhofer IZFP ()
Near Field Scanning Optical Microscopy (NSOM); Nano-Raman Microscopy; thermal wave microscopy; Atomic Force Acoustic Microscopy; AFAM

Abstract
Advanced techniques for nondestructive evaluation (NDE), having volume resolutions better than 1 micrometer voxel (three dimensional pixel) size, are urgently needed for the safety and reliability of electronic systems, especially those used in extended life applications. This paper presents the current status and future vision of sub-nanometer NDE. Techniques like acoustic- and X-ray microscopy, Near Field Scanning Optical Microscopy (NSOM), Nano-Raman microscopy, thermal wave microscopy, Atomic Force Acoustic Microscopy (AFAM) and others are described. The principles are briefly introduced, and applications are discussed and demonstrated with examples.

: http://publica.fraunhofer.de/dokumente/N-76568.html