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DAVID - A strategic research project for chip-scale MEMS/ASIC co-integration

DAVID - ein strategisches Forschungsprojekt für MEMS/ASIC-Systemintegration im Chip-Maßstab
 
: Marenco, N.; Reinert, W.; Warnat, S.

International Microelectronics and Packaging Society -IMAPS-:
EMPC 2007, the 16th European Microelectronics and Packaging Conference & Exhibition. Proceedings. Pt. 2 : June 17 - 20, 2007, Oulu, Finland
Oulu, 2007
ISBN: 978-952-997511-2
S.640-642
European Microelectronics and Packaging Conference and Exhibition (EMPC) <16, 2007, Oulu>
Englisch
Konferenzbeitrag
Fraunhofer ISIT ()
ASIC; Bauelementzuverlässigkeit; Bondieren; Chip-Size-Gehäuse; Design (Entwurf); Einkapselung; Fertigungsverfahren; Finite Elemente Methode; Forschungsprojekt; mechanische Belastung; MEMS; mikroelektromechanisches System; Restspannung; System-in-Package Technologie; Vakuumtechnik; Wafer-Montage; Wärmespannung

Abstract
A hybrid wafer level packaging approach is presented that targets basically the industrial high-volume production of inertial measurement units. In a joint effort of six renowned European partners under the FP6 project DAVID, key technologies like post-CMOS through-silicon vias, vacuum compliant chip-to-wafer bonding and wafer level transfer molding are developed. The objective is a Chip-Scale System-in-Package (CSSiP) solution that can be implemented with a moderate effort and thus allows a realization of smart sensor systems in a short loop between design and manufacturing. Individual design and manufacturing steps are discussed: the optimal 4x4 mm2 size for the inertial sensor and possibilities of size reduction, the C2W (Chip-to-Wafer) process with two succesive steps, a pre-fixation of each single die on the substrate wafer and the simultaneous final bonding step, the W2W (Wafer-to-Wafer) approach, the problems in the TSV (Through-Silicon Via) step with thermomechanical stress, the final encapsulation and possible cost reduction using wafer molding and solder balling or transfer molding, and design aspects in 3D ASIC/MEMS integration using FEM simulations for optimization. An ultra-fine leak test for monitoring the vacuum quality in the sensor based on an initial neon bombing has been developed. Further details can be found on http://www.david-project.eu.

: http://publica.fraunhofer.de/dokumente/N-76545.html