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3D system integration

 
: Klumpp, A.; Merkel, R.; Ramm, P.; Wieland, R.

:

Institute of Electrical and Electronics Engineers -IEEE-:
13th International Symposium on VLSI Technology, Systems and Applications, VLSI-TSA 2007 : 23-25 April 2007, Hsinchu, Taiwan
New York, NY: IEEE, 2007
ISBN: 1-4244-0585-8
S.1-2
International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) <13, 2007, Hsinchu>
Englisch
Konferenzbeitrag
Fraunhofer IZM ()

Abstract
3D-Integration is a promising technology towards higher interconnect densities and shorter wiring lengths between multiple chip stacks, thus achieving a very high performance level combined with low power consumption. This technology also offers the possibility to build up systems with high complexity just by combining devices of different technologies. For ultra thin silicon is the base of this integration technology, the fundamental concepts will be described, as well as appropriate handling concepts.

: http://publica.fraunhofer.de/dokumente/N-74906.html