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Handling ultra-thin wafers

Mobile electrostatic carriers enable bumping
 
: Landesberger, C.; Scherbaum, S.; Bollmann, D.; Bock, K.

Advanced packaging 16 (2007), Nr.4, S.32-38
ISSN: 0747-1599
ISSN: 1065-0555
Englisch
Zeitschriftenaufsatz
Fraunhofer IZM ()

Abstract
A novel carrier technique for thin-wafer processing uses electrostatic forces for reversible attachment of delicate wafers to a rigid support substrate. This mobile electrostatic carrier is based on e-chucks that are currently built into processing equipment, but has been adapted to make transport and handling feasible.

: http://publica.fraunhofer.de/dokumente/N-71723.html