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Vertically coupled microring laser devices based on InP using BCB waferbonding

 
: Hamacher, M.; Troppenz, U.; Heidrich, H.; Dragoi, V.

:

Institute of Electrical and Electronics Engineers -IEEE-:
CLEO Europe - IQEC 2007. Conference digest. CD-ROM : Munich, Germany, 17 - 22 June
Piscataway, NJ: IEEE, 2007
ISBN: 1-4244-0931-4
ISBN: 978-1-4244-0931-0
1 S.
Conference on Lasers and Electro-Optics Europe (CLEO Europe) <2007, München>
International Quantum Electronics Conference (IQEC) <2007, München>
Englisch
Konferenzbeitrag
Fraunhofer HHI ()
III-V semiconductors; indium compounds; integrated optics; laser cavity resonator; micro-optics; optical fabrication; optical waveguide; ring laser; semiconductor laser; wafer bonding

Abstract
In this paper, we present our approach on the realization of vertical coupling technology that has been verified for microlaser fabrication as well as for the realization of high Q resonators with 'loss-less' cavities based on InP. The concept is based on full wafer technology and provides the integration of an optical transparent passive bus waveguide vertically coupled to the active ring laser.
Entnommen aus TEMA

: http://publica.fraunhofer.de/dokumente/N-71415.html