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Development of micro-integrated sensors and actuators based on PZT thick films

 
: Gebhardt, S.E.; Rödig, T.; Partsch, U.; Schönecker, A.J.

International Microelectronics and Packaging Society -IMAPS-:
EMPC 2007, the 16th European Microelectronics and Packaging Conference & Exhibition. Proceedings. Pt. 1 : June 17 - 20, 2007, Oulu, Finland
Oulu, 2007
ISBN: 978-952-997511-2
S.177-181
European Microelectronics and Packaging Conference and Exhibition (EMPC) <16, 2007, Oulu>
Englisch
Konferenzbeitrag
Fraunhofer IKTS ()
PZT=Bleititanatzirkonat; Dickfilm; Dickfilmpaste; Sensor; Aktuator; Ultraschallwandler; Siebdruck; Mikrosystem

Abstract
Al2O3, Silicon (Si) and Low Temperature Co-fired Ceramics (LTCC) are key functional materials, forming the substrate basis for microsystems technologies. They allow for three dimensional component integration, high robustness and excellent reliability. The combination of these substrate materials with piezoelectric films offer advanced sensor, actuator and ultrasonic transducer solutions which open new fields of application. Lead Zirconate Titanate (PZT, PbZrTiO3) is the most common piezoelectric material because of its excellent ferroelectric and electromechanical properties. Integration needs engineered solution concerning design, PZT and electrode material selection as well as controlled processing. Most reliable interface solutions were achieved by screen printing and firing PZT thick films directly onto the substrate. Therefore a unique PZT thick film paste was developed recently. Sensors and actuators for microsystems applications like for example piezoelectric pressure sensors, ferroelectric printing forms and deformable mirrors have been developed successfully. The present paper deals with the feasibility of screen printable ultrasonic transducers and micro actuators on LTCC and Si-Wafer. Three possible applications were presented in this article: an ultrasonic transducer based on Al2O3, a bending micro actuator based on LTCC and an active mirror based on a 6 inch Silicon wafer.
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: http://publica.fraunhofer.de/dokumente/N-69337.html