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2006
Conference Paper
Titel
Modelling effects of packaging on pull-in behaviour of doubly-anchored beams
Abstract
Understanding the influence of the packaging process on MEMS device performance is critical for a successful design and analysis of both the device and the package. This paper is concerned with accurate prediction of the effects of packaging processes on the pull-in behaviour of doubly anchored microbeams. Results of parametric studies on the effect of gluing (die attach) on the pull-in behaviour of beams of various lengths, widths, anchor types, adhesives and adhesive thickness are presented. Where experimental data were available, a good correlation between measured and simulated results was achieved.