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Conductive UV curable adhesives for printed RFID antenna structures

Leitfähige, UV-vernetzbare Klebstoffe für gedruckte RFID-Antennenstrukturen
: Kowalik, T.; Worch, S.; Hartwig, A.; Joachimi, H.


Adler, H.-J.:
Reactive polymers in inhomogeneous systems, in melts, and at interfaces : Selected contributions from the 3rd International Symposium "React 2007" in Dresden (Germany), September 23 - 26, 2007
Weinheim: Wiley-VCH, 2007 (Macromolecular symposia 254)
International Symposium on Reactive Polymers in Inhomogeneous Systems, in Melts and at Interfaces (React) <3, 2007, Dresden>
Konferenzbeitrag, Zeitschriftenaufsatz
Fraunhofer IFAM ()
Klebstoff; elektrische Leitfähigkeit; Füllstoff; Silber; Pigment; Strahlenvernetzen; UV-Bestrahlung; Hochfrequenzkennzeichnung; Antenne; Flexographie; Offsetdruck; Polyhydroxyethylmethacrylat; Bedruckung

Based on 2-hydroxyethyl methacrylate resins formulations were developed, which could be used for the application as RFID (radio frequency identification) antenna structures. For a very fast and low cost manufacturing of these antenna structures, the process should be an offset printing or flexography printing process with an integrated curing process, here UV curing. Necessary for the antenna properties is the conductivity as high as possible. It was shown that silver filled formulations were developed, which could be fully cured by UV light and processed with offset printing and flexography. The in the offset printing process produced skips in the layer reduced the observable volume resistance to such a low value that no antenna properties could be observed, although the layers produced with a squeegee showed volume resistance up to 10(exp -3) Ohm/cm The flexography produced antenna structures showed a quite good volume resistance from 5 10(exp -4) Ohm, which means a maximum distance between emitter and receiver devices of 0.86 m The presented formulations together with the printing processes make a cheaper and quicker production of the RFID antennas possible and therefore a big step for a broader application of this technology is done.
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