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Characterization of thermal interface materials

: Schacht, R.; May, D.; Wunderle, B.; Wittler, O.; Gollhardt, A.; Michel, B.


TU Dresden, Institut für Aufbau- und Verbindungstechnik der Elektronik -IAVT-; Institute of Electrical and Electronics Engineers -IEEE-:
1st Electronics Systemintegration Technology Conference, ESTC 2006. Vol.2 : Dresden, 5.-7.9.2006
New York, NY: IEEE, 2006
ISBN: 1-4244-0552-1
ISBN: 1-4244-0553-X
Electronics Systemintegration Technology Conference (ESTC) <1, 2006, Dresden>
Fraunhofer IZM ()

In this paper new characterization equipment for thermal interface materials is presented. Thermal management of electronic products relies on the effective dissipation of heat. This can be achieved by the optimization of the system design with the help of simulation methods. The precision of these models relies also on the used material data. For the determination of this data an experimental set-up for a static measurement is presented, which evaluate thermal conductivity of thermal interface materials (e.g. adhesive, solder, pads, or pastes). The paper gives an overview over the set-up and the measurement technique and discusses experimental and simulation results.