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Performance and thermo-mechanical reliability of micro-channel coolers - a parametric study

: Wunderle, B.; Schacht, R.; Wittler, O.; Michel, B.; Reichl, H.


Ramakrishna, K. ; IEEE Components, Packaging, and Manufacturing Technology Society; American Society of Mechanical Engineers -ASME-:
ITherm 2004, the Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. Vol.2 : Mirage Hotel & Casino, Las Vegas, NV, June 1 - June 4, 2004
Piscataway, NJ: IEEE, 2004
ISBN: 0-7803-8357-5
Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) <9, 2004, Las Vegas/Nev.>
Fraunhofer IZM ()
parametric study; microchannel cooler; reliability

In the paper we present an approach based on this principle to design reliable thermal management solutions for high power applications. Thermal and thermo-mechanical reliability are measured and calculated for a flip-chip mounted die with a hot-spot using reverse-side micro-channel water cooling as cooling concept. Hereby the methodology starts by material characterisation and consistent numerical implementation. Then a numerical parametric study as to geometrical features and interface materials is carried out by coupled fluidic-thermal analysis in order to evaluate the most promising variant for optimum thermal performance within the employed technology. For experimental verification a computer-controlled closed-loop thermal-fluidic testing set-up was constructed. Good correlation was found between measured, simulated and analytical results.