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Thermo-mechanical reliability aspects and finite element simulation in packaging

: Dudek, R.; Auersperg, J.; Michel, B.; Reichl, H.

Iyer, M.K. ; Institute of Electrical and Electronics Engineers -IEEE-, Singapore Section, Reliability CPMT EDS Chapter; Components, Packaging and Manufacturing Technology Society -CPMT-; International Microelectronics and Packaging Society -IMAPS-:
5th Electronics Packaging Technology Conference, EPTC 2003. Proceedings : 10 - 12 December 2003, Pan Pacific Hotel, Singapore
Piscataway, NJ: IEEE, 2003
ISBN: 0-7803-8205-6
ISBN: 0-7803-8206-4
Electronics Packaging Technology Conference (EPTC) <5, 2003, Singapore>
Fraunhofer IZM ()

Computer-based thermo-mechanical design and performance optimization are in widespread use and mainly work with finite-element analysis (FEA). Concepts of FEA-based theoretical investigations on the failure of the precision material compounds used in microsystem technology are briefly introduced. The phenomenon of stresses at interfaces between dissimilar materials is of special importance within the variety of failure criteria and is therefore discussed in more detail. The stress state at interfacial edges is shown to be strongly localized as has to be expected from the often singular elastic solution at an interface edge. Aspects of the failure analysis for three important material classes, i.e. polymeric materials, thin electrodeposited metallic layers and soft solders are considered. The different appropriate constitutive models and related failure criteria are given. They require a certain amount of input material parameters, for which measuring results are provided. For polymeric materials, standard thermo-elastic data, isothermal relaxation data, and fracture toughness data is exemplified. Elastic-plastic modeling is looked at for copper thin films. Finally, soft solder characteristics and failure data are presented.