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The size effect on the creep properties of SnAgCu-solder alloys

 
: Wiese, S.; Roellig, M.; Mueller, M.; Wolter, K.-J.; Bennemann, S.; Petzold, M.

:

Institute of Electrical and Electronics Engineers -IEEE-; IEEE Components, Packaging, and Manufacturing Technology Society:
IEEE 57th Electronic Components and Technology Conference 2007. Vol.2 : Sparks, NV, 29 May - June 1, 2007
Piscataway, NJ: IEEE, 2007
ISBN: 1-4244-0984-5
ISBN: 1-4244-0985-3
S.548-557
Electronic Components and Technology Conference (ECTC) <57, 2007, Reno/Nev.>
Englisch
Konferenzbeitrag
Fraunhofer IWM ()
microelectronic; lead-free solder; creep; mechanical testing; microstructure; size effect

Abstract
The paper describes the strategies of characterizing the creep behaviour of SnAg- and SnAgCu-solders through experiments on bulk specimens and on very tiny solder joints. The characteristic behaviour of these different volumes will be explained and rationalized by metallurgical considerations about the specifics of solidification in very small volumes.

: http://publica.fraunhofer.de/dokumente/N-66694.html