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Influence of the thermal treatment during the saw damage etching process on the mechanical stability of multicrystalline silicon wafers

 
: Borchert, D.; Riepe, S.; Kübler, R.; Beinert, J.; Kraft, T.; Kleer, G.; Petri, S.

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IEEE Electron Devices Society:
IEEE 4th World Conference on Photovoltaic Energy Conversion 2006. Vol.1 : Waikoloa, Hawaii, 7 - 12 May 2006
Piscataway, NJ: IEEE Operations Center, 2006
ISBN: 1-4244-0017-1 (Print)
ISBN: 1-4244-0016-3 (Online)
S.1085-1087
World Conference on Photovoltaic Energy Conversion (WCPEC) <4, 2006, Waikoloa/Hawaii>
Englisch
Konferenzbeitrag
Fraunhofer ISE ()
Fraunhofer IWM ()
saw damage etching; multicrystalline silicon wafer; mechanical stability; thermal treatment

Abstract
The influence of the thermal treatment during the saw damage etching process on the mechanical stability of multicrystalline silicon wafers has been investigated for four different alkaline saw damage etching procedures. After the different etching procedures the mechanical stabilities of the multicrystalline wafers have been measured using the concentric ring test and the four-point-bending test. The experimental results are compared to those obtained by numerical simulations.

: http://publica.fraunhofer.de/dokumente/N-66559.html