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New concepts for the front side metallization of silicon solar cells

: Glunz, S.W.; Mette, A.; Aleman, M.; Richter, P.L.; Filipovic, A.; Willeke, G.

Preprint urn:nbn:de:0011-n-664897 (932 KByte PDF)
MD5 Fingerprint: 4276c308fdc5d700c88a905e084aee75
Erstellt am: 24.1.2009

Poortmans, J. ; European Commission, Joint Research Centre -JRC-:
21st European Photovoltaic Solar Energy Conference 2006. Proceedings. CD-ROM : Proceedings of the international conference held in Dresden, Germany, 4 - 8 September 2006
München: WIP-Renewable Energies, 2006
ISBN: 3-936338-20-5
European Photovoltaic Solar Energy Conference <21, 2006, Dresden>
Konferenzbeitrag, Elektronische Publikation
Fraunhofer ISE ()

For the fabrication of front side grids with a higher efficiency potential than screen-printed contacts, two-layer processes are very promising. In the seed step a thin metal line is deposited which forms the mechanical and electrical contact to the emitter. In the growth step this seed layer is thickened by a plating process to increase line conductivity. In our approach the plating is performed using the so-called light-induced plating process. For this technique the solar cell has to be contacted only at the rear which facilitates the transfer into industrial production with high through-put. Several methods to create the seed layer are discussed in this paper: Fine-line pad printing of silver screen-printing pastes, laser sintering/melting of metal powders, chemical Ni plating on solar cells with a structured dielectric layer and aerosol metal jetting. Very encouraging results are achieved for all these technologies.