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Biocompatible hybrid flip-chip microsystem integration for next generation wireless neural interfaces
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2006
Conference Paper
Titel
Biocompatible hybrid flip-chip microsystem integration for next generation wireless neural interfaces
Author(s)
Töpper, M.
Klein, M.
Buschick, K.
Glaw, V.
Orth, K.
Ehrmann, O.
Hutter, M.
Oppermann, H.
Becker, K.-F.
Braun, T.
Ebling, F.
Reichl, H.
Kim, S.
Tathireddy, P.
Chakravarty, S.
Solzbacher, F.
Hauptwerk
ECTC 2006, the 56th Electronic Components and Technology Conference. Proceedings. CD-ROM
Konferenz
Electronic Components and Technology Conference (ECTC) 2006
DOI
10.1109/ECTC.2006.1645734
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM