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RF/Microwave Modeling of SiP Modules - A novel approach

: Ndip, I.; Reichl, H.; Guttowski, S.

International Microelectronics and Packaging Society -IMAPS-:
International Symposium on Microelectronics 2006. Proceedings : October 8 - 12, 2006, San Diego, California, USA
Washington, DC: IMAPS, 2006
ISBN: 0-930815-80-7
International Symposium on Microelectronics <39, 2006, San Diego/Calif.>
Fraunhofer IZM ()

A novel approach for the development of wideband models that take into account the parasitic effects of all interconnecting components along complete signal paths in system-in-package (SiP) modules at RF/microwave frequencies is presented. In order to develop these models, the multilumped modeling technique was used. So far, multilumped modeling has been applied only to uniform transmission lines, where only the fundamental mode of propagation e.g., transverse electromagnetic (TEM) or quasi-TEM, is present. However, SiP modules are very complex structures, consisting almost entirely of geometrical discontinuities that excite higher-order modes (HOMs). So, unlike in uniform transmission lines where only a single wave mode exists, there is a combination of TEM/quasi-TEM modes and HOMs in SiP modules. Consequently, prior to applying multilumped modeling in this work, a novel technique for defining the boundaries of all discontinuities in SiP modules was first developed. Based on these boundaries, the signal path was segmented and each segment efficiently characterized, taking into consideration electromagnetic coupling (EM) between neighboring segments. The validated models for each segment were then cascaded to generate a wideband model for the entire path. This model was also experimentally validated, and used to perform numerous signal integrity (SI) investigations at the pre-layout phase, from which design guidelines to keep SI effects within acceptable limits were derived.