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Industrial wafer level vacuum encapsulation of resonating MEMS devices
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2006
Conference Paper
Titel
Industrial wafer level vacuum encapsulation of resonating MEMS devices
Author(s)
Reinert, W.
Hauptwerk
DTIP of MEMS & MOEMS : design, test, integration and packaging of MEMS/MOEMS 2006
Konferenz
Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2006
Conference Microfabrication, Integration and Packaging 2006
Conference CAD, Design and Test 2006
Language
English
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Fraunhofer-Institut für Siliziumtechnologie ISIT