Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Advanced integration technology for fabricating high-speed electro-optical sub-assembly

 
: Palavesam, Nagarajan; Choi, Jung Han; Hell, Waltraud; Fiol, Gerrit; Velthaus, Karl-Otto; Zerna, Conrad; Gieser, Horst; Landesberger, Christof

:

Institute of Electrical and Electronics Engineers -IEEE-; International Microelectronics and Packaging Society -IMAPS-:
23rd European Microelectronics and Packaging Conference & Exhibition, EMPC 2021 : 13-16 September 2021, Online
Piscataway, NJ: IEEE, 2021
ISBN: 978-1-6654-2368-7
ISBN: 978-0-9568086-7-7
S.258-262
European Microelectronics and Packaging Conference & Exhibition (EMPC) <23, 2021, Online>
Englisch
Konferenzbeitrag
Fraunhofer EMFT ()
Fraunhofer HHI ()
Fraunhofer IIS ()
flexible electronics; hybrid integration; advanced packaging; flexible hybrid electronics; printed electronics

Abstract
Here, we report flip-chip bonding processes based on Anisotropic Conductive Film (ACF) and Sn-Ag-Cu (SAC) solder implemented for bonding three test chips (two Silicon, Si ICs on either side of an Indium Phosphide, InP IC) in series on 25μm thick polyimide foil substrates. Si ICs were bonded only with SAC solder, whereas both SAC and ACF were applied for the flip-chip integration of the fragile InP chips. RF measurements were then performed on the impedance controlled paths across the polyimide foil of the fabricated assemblies to evaluate as well as to compare the RF performance of ACF and SAC solder in terms of the differential S 21 parameter. The measurements revealed that when ACF is employed for interconnecting the InP chip and SAC solder for the two Si chips, a higher 3 dB bandwidth of 42 GHz was obtained whereas a 3 dB bandwidth of only 31 - 34 GHz was measured when only SAC solder was used for bonding all three ICs. These measurement results confirm that a higher bandwidth can be obtained from the assemblies when ACF is used as the interconnection material. Therefore, it can be concluded that the ACF based integration technology could be favored over solder processes for bonding high performance multi Gbit/s subassemblies, especially with higher density of contact pads.

: http://publica.fraunhofer.de/dokumente/N-645335.html