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Challenges In RF Design

Redaktionell betreuter Blogbeitrag auf https://semiengineering.com, October 14th, 2021
 
: Jancke, Roland; Heinig, Andy

:
Volltext ()

Online im WWW, 2021
Englisch
Blogbeitrag, Elektronische Publikation
Fraunhofer IIS, Institutsteil Entwicklung Adaptiver Systeme (EAS) ()

Abstract
Special attention must be paid to the non-functional properties of RF components: Designing highly integrated components for radio frequency applications poses special challenges for system engineers, designers and the commissioning engineers. The boundary between chip, package and board is increasingly vanishing on modern components. It is growing more common for parts of the functionality to be moved to the package or even the board. In some cases, the requirements have become so expansive that the functionality can only be guaranteed with perfect interaction between chip, package and board. To ensure a robust and reliable design for such components, a number of physical effects must be taken into account with special tests and their influence must be evaluated. This is in addition to the usual effects observed in other components and the associated testing, such as timing, voltage drop, etc.

: http://publica.fraunhofer.de/dokumente/N-642733.html