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Simple and Powerful encapsulation through Hybrid Packaging for Electrochemical Transducers

 
: Steinmaßl, Matthias; Boudaden, Jamila; Hell, Waltraud; Kutter, Christoph

:

Smart Systems Integration, SSI 2021 : Grenoble, France, 27 – 29 April 2021
Piscataway, NJ: IEEE, 2021
ISBN: 978-1-6654-4092-9
ISBN: 978-1-6654-3117-0
S.107-110
International Conference and Exhibition on Smart Systems Integration (SSI) <2021, Online>
Englisch
Konferenzbeitrag
Fraunhofer EMFT ()
flexible hybrid packaging; encapsulation; chemical sensor

Abstract
We present a simple and reliable hybrid packaging of rigid electrochemical transducers and flexible foil having electrical connections. Among a large number of biochemical transducers, we target in this work two types of transducers: 3-electrode systems and ion selective field effect transistors (ISFET). The hybrid packaging ensures several requirements such as: biocompatibility to biological analytes, precise tight encapsulation, protection of transducers surface, mechanical stability, reliable electrical contact and light shielding of sensitive parts. The proposed hybrid packaging of biochemical transducers is based on a flip-chip bonding process, which necessitates low-cost materials, a reduced number of processing steps as well as compatibility to common roll-to-roll (R2R) processes.

: http://publica.fraunhofer.de/dokumente/N-642547.html