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Surface modification on copper particles toward graphene reinforced copper matrix composites for electrical engineering application

 
: Shu, Shengcheng; Zhang, Qiang; Ihde, Jörg; Yuan, Qilong; Dai, Wen; Wu, Mingliang; Dai, Dan; Yang, Ke; Wang, Bo; Xue, Chen; Ma, Hongbing; Zhang, Xu; Han, Jiemin; Chen, Xuyuan; Lin, Cheng-Te; Ren, Wanbin; Ma, Yifei; Jiang, Nan

:

Journal of alloys and compounds 891 (2022), Art. 162058, 8 S.
ISSN: 0925-8388
Englisch
Zeitschriftenaufsatz
Fraunhofer IFAM ()
graphene nanoplatelet; copper matrix composite; surface modification

Abstract
Graphene has been demonstrated as an effective reinforcement for metal matrix composites, due to its excellent mechanical properties, robust chemical inertness, thermal stability, and self-lubricating. Nevertheless, the limiting factor for its further use in metal matrix composites, is to realize the homogeneous dispersion of graphene for taking advantage of its exceptional and fascinating properties, because of the poor wettability and density contrast between metal matrix and graphene. Herein, we design a gel-assisted route to synthesize high-quality graphene nanoplatelets modified monodispersed copper particles, followed by hot pressing to fabricate graphene reinforced copper matrix composites bulk. This simple route with high efficiency and low cost, offers a new solution for the mass-production of graphene reinforced copper matrix composites and other graphene-based composites on an industrial scale. Significantly enhanced tensile strength of 253 MPa, and yield strength of 145 MPa, accompanied by the low friction coefficient and improved wear resistance, can be simultaneously achieved in the composites. For the real electrical contact performance test, the service life of electrical contacts made of graphene reinforced copper matrix composites, is 10 times longer as that of the commercial pure copper electrical contacts and almost comparable to CuAg20 contacts, demonstrating its superior ability to solve the electrical contact issues in electrical engineering systems.

: http://publica.fraunhofer.de/dokumente/N-641496.html